Process Technology Research & Development Center

In order to fabricate the most advanced semiconductor devices, many process steps must be repeated that utilize the most advanced chemistry and physics. The Process Technology Research & Development Center performs R&D of deposition technology of new-material films required for the next-generation memories, new pattering technology such as NGL (next-generation lithography), mask technology, dry or wet etching technology to process new materials, deep holes and complicated structures, low-resistance metal wiring technology for high-speed memories, metrology and analysis technologies for new materials and new structures, manufacturing technology to realize them, and test production of advanced devices.

By establishing the core competence of memory technology by new processes, the Process Technology Research & Development Center aims to create valuable foundation processes, process technology that enhances the competitiveness of memory products, and transfer the process technologies to mass-production engineering departments and factories through horizontal deployment and deep cultivation.

Process Technology

Location

  • Yokkaichi Plant (Yokkaichi City, Mie Prefecture, Japan)
  • Yokohama Suboffice of the Yokohama Technology Campus (Yokohama City, Kanagawa Prefecture, Japan)
  • Suboffice of the Yokohama Technology Campus at the Corporate Manufacturing Engineering Center
  • Komukai Suboffice of the Yokohama Technology Campus (Kawasaki City, Kanagawa Prefecture, Japan)

Technology Topics

Next-generation lithography process: Nanoimprint

Next-generation lithography process: Nanoimprint

Analytical technologies for next-generation devices

Analytical technologies for next-generation devices

Image processing technology utilizing machine learning

Image processing technology utilizing machine learning

14nm Half-pitch Direct Patterning with Nanoimprint Lithography

14nm Half-pitch Direct Patterning with Nanoimprint Lithography